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2024 4th International Conference on Measurement Instrumentation and Electronics will be held in Chengdu, China during September 18-20, 2024.
It has the goal to be an annual conference for researchers, academicians and industry persons in the field of Measurement Instrumentation and Electronics. We hope that this conference will attract a large number of delegates from all over the world and will consist of very high quality technical sessions.
A measuring instrument is a device for measuring a physical quantity. In the physical sciences, quality assurance, and engineering, measurement is the activity of obtaining and comparing physical quantities of real-world objects and events.
西柚加速器用不了了-猴王加速器
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西柚加速器用不了了-猴王加速器
Submissions will be peer reviewed and evaluated based on originality, relevance to conference, contributions, and presentation.
All accepted (Registered & Presented) papers of ICMIE 2024 will be collected into MATEC Web of Conferences (ISSN: 2261-236X), which is indexed by Ei Compendex, Inspec, DOAJ, Web of Science (CPCI), etc.
ICMIE 2016 proceedings (Click)
ICMIE 2017 proceedings (Click)
ICMIE 2018 proceedings (Click)
As Author, you can publish the manuscript and deliver paper presentation on ICMIE 2024, orally or poster presentation. You must submit Full-length Manuscript for review before the submission deadline. Conference package (all conference tracks, morning, and afternoon tea, lunch and dinner); Conference materials; 15 Minutes presentation time; Paper be published into the conference proceedings.
As Presenter, you can deliver a presentation on ICMIE 2024, but the presented manuscript WILL NOT be published. Abstract is necessary to submit. Conference package (all conference tracks, morning, and afternoon tea, lunch and dinner); Conference materials; 15 Minutes presentation time.
As Listener, you can participate and attend all the presentation sessions only, neither making presentation nor having paper published. Conference package (all conference tracks, morning, and afternoon tea, lunch and dinner); Conference materials.